Production

Manufacturing Overview
Pascall manufactures and tests all of its products in-house.

Production capabilities include:

• Automated Surface Mount Assembly
• Automatic Optical Inspection
• Thro-Hole Assembly and Soldering
• PCB Cleaning
• Con-formal coating
• PCB integration to chassis (incl wiring as required)
• Electrical verification testing
• Temperature cycling testing (as required)
• Temperature soak (Burn-in) testing (as required)

Pascall surface mount placement capabilities was enhanced in 2008 with the addition of new equipment:

• Mydata : MY15E Pick and Place machine
• DEK : Horizon 03I Screen Printer

This equipment will supplement the existing Quad QSP-2 twin set up. Whilst the QSP-'s have a large feeder count they are not capable of placing some of the components required by existing customers and limit the component selection available to the Design Engineers.

Specifically, the Mydata adds the capability of accurately placing BGAs, QFPs and standard surface mount components to chip size 01005. Additionally, Mydata offers superior flexibility in terms of component packaging loading. Ie. It is able to accommodate small strips of components via the use of Agilis feeders.

The following performance measures are reviewed monthly:

• On-Time Delivery
  • Production Deliveries to customer vs due date
  • SM completion vs due date
  • TH completion vs due date
  • GA/Test Completion vs due date
• Initial Test Yields
  • Product yields at initial test
  • Fault types for each assy area
• Warranty Customer Returns
• Scrap costs

Lead Free Manufacturing

Dedicated benches are available for Lead-Free assembly and soldering. Sample products assembled through this line were submitted for independent RoHS testing and were confirmed as compliant. It is anticipated that this will remain a relatively small proportion of our overall manufacture.

Clean Room

With a 41 square metre manufacturing area the class 7/(class 10,000) clean room is capable of chip and wire with integration of bare die onto a range of base materials, using gold and aluminium wire bonds for optimum miniaturisation.

Diameters between 0.0007 to 0.002 can be achieved by wire bonding onto a variety of substrates. The facility to precision die attach with gold and aluminium wire bonding with deep access facility is also obtainable.